DocumentCode :
2276567
Title :
Real-time, continuous large particle monitoring for CMP slurry quality control
Author :
Kim, Andy ; Murai, Koh ; Parkin, Michael ; Mavliev, Rashid
Author_Institution :
Mega Fluid Syst., Tualatin, OR, USA
fYear :
2012
fDate :
15-17 May 2012
Firstpage :
227
Lastpage :
230
Abstract :
With each new technology node, the cost of scratches during chemical-mechanical planarization (CMP) becomes higher in terms of tool downtime, process yield, and device reliability. Large particles (LPC) in the slurry are known to increase the likelihood of scratching; therefore, considerable resources are spent to quantify their number [1-4] and improve methods for detection [5, 6]. This paper explores a relatively new technology for large particle counting, the SlurryScope from Vantage Technology Corporation, as a potential means for more advanced processing and control of slurry supplied to the CMP line.
Keywords :
chemical mechanical polishing; quality control; slurries; CMP line; CMP slurry quality control; SlurryScope; chemical-mechanical planarization; continuous large particle monitoring; device reliability; large particle counting; scratching; technology node; Atmospheric measurements; Filter banks; Filtration; Monitoring; Particle measurements; Real time systems; Slurries; CMP; LPC; scratching; undiluted slurry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location :
Saratoga Springs, NY
ISSN :
1078-8743
Print_ISBN :
978-1-4673-0350-7
Type :
conf
DOI :
10.1109/ASMC.2012.6212895
Filename :
6212895
Link To Document :
بازگشت