DocumentCode
2276596
Title
A failure model of heating filaments in epitaxial growth tools
Author
Hui, Keung ; Mou, Jason
Author_Institution
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
fYear
2012
fDate
15-17 May 2012
Firstpage
146
Lastpage
150
Abstract
This paper presents a failure model of heating filaments as used in semiconductor manufacturing tools for growing epitaxial films. Attempts were endeavoured to provide feasible physical insights on the observations in changes of impedance as indirectly derived via readings of voltage-current measurements, instead of conventional data-driven black-box approach of statistical regressions. The proposed model is able to predict the magnitudes of these impedance changes and the classification result lends itself to the setting up of quantifiable control limits to enable early warnings of fault detections in process controls.
Keywords
electric current measurement; epitaxial growth; failure analysis; fault diagnosis; filament lamps; heating; process control; regression analysis; semiconductor device manufacture; voltage measurement; control limits; data-driven black box approach; early warnings; epitaxial growth tools; failure model; fault detection; heating filaments; impedance change magnitude; process control; semiconductor manufacturing tools; statistical regression; voltage-current measurements; Coils; Heating; Impedance; Inductance; Integrated circuit modeling; Stress; Temperature measurement; advanced process control; fault detection and classification; model-based control;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-0350-7
Type
conf
DOI
10.1109/ASMC.2012.6212898
Filename
6212898
Link To Document