Title :
Impact of data center cooling strategies on component reliability
Author :
Daniel, Andy ; Ahuja, Narendra
Abstract :
In a data center environment, the temperature that a chip experiences is an important parameter determining its reliability. A high operating temperature can cause it to wearout prematurely. A low temperature results in additional cooling costs to operate the data center. In typical data center operation, there arises a distribution of component temperatures that are sensitive to the specific cooling strategies being used. This paper evaluates the impact of various data center cooling strategies on component reliability focusing on the gate oxide time dependent dielectric breakdown (TDDB) mechanism on a 32nm chipset component.
Keywords :
air conditioning; computer centres; electric breakdown; thermal management (packaging); TDDB mechanism; chipset component; component reliability; data center cooling strategies; data center environment; data center operation; gate oxide; high operating temperature; size 32 nm; time dependent dielectric breakdown mechanism; Cooling; Integrated circuit reliability; Logic gates; Market research; Temperature distribution; Temperature sensors; Air Conditioning Unit; Air Handling Unit; Component reliability; Computer room air conditioner; gate oxide (TDDB) mechanism;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014 30th Annual
Conference_Location :
San Jose, CA
DOI :
10.1109/SEMI-THERM.2014.6892239
