Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies

In this article we investigate the different failure mechanisms in IGBT modules as a result of power cycling tests. The power cycling is carried out with different control strategies, such as constant current load, constant power and constant junction temperature. With the continuous monitoring of the tested device voltage, junction temperatures and periodic thermal transient tests, the crack of the wire bonds or even degradation of the die attach layer can be identified. A comparison between the effects of the studied control strategies on the lifetime of the tested device is also presented.