Title :
Framework for integration of virtual metrology and predictive maintenance
Author :
Roeder, Georg ; Mattes, Andreas ; Pfeffer, Markus ; Schellenberger, Martin ; Pfitzner, Lothar ; Knapp, Alexander ; Mühlberger, Heribert ; Kyek, Andreas ; Lenz, Benjamin ; Frisch, Markus ; Bichlmeier, Josef ; Leditzky, Günter ; Lind, Erich ; Zoia, Silvia ;
Author_Institution :
Fraunhofer IISB, Erlangen, Germany
Abstract :
Within the ENIAC project “IMPROVE”, new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers in Europe, solution providers, and research institutions. A major objective of the project is to make these new APC methods applicable in the existing fab systems of the IC manufacturers which widely differ in the automation infrastructure. A novel framework architecture for integration of the new control paradigms was researched and a software for implementation of the framework was developed. This paper describes the technical details and results of the framework development, implementation, and test.
Keywords :
integrated circuit manufacture; maintenance engineering; process control; production engineering computing; semiconductor industry; service-oriented architecture; virtual instrumentation; APC methods; ENIAC project; European semiconductor manufacturing; IC manufacturers; IMPROVE; advanced process control; automation infrastructure; control paradigms; fab systems; predictive maintenance; research institutions; software development; solution providers; virtual metrology; Application software; Computer architecture; Integrated circuits; Java; Maintenance engineering; Metrology; Unified modeling language; APC framework; Advanced Process Control; Equipment Engineering System; SOA; Virtual Metrology Predictive Maintenance;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI
Conference_Location :
Saratoga Springs, NY
Print_ISBN :
978-1-4673-0350-7
DOI :
10.1109/ASMC.2012.6212913