• DocumentCode
    2276952
  • Title

    The thermal model building and calculation of portable air enclosure

  • Author

    Han, B. ; Li, X. ; Li, C.

  • Author_Institution
    Coll. of Precision Instrum. & Opto-Electron. Eng., Tianjin Univ., Tianjin
  • fYear
    2008
  • fDate
    8-13 June 2008
  • Firstpage
    158
  • Lastpage
    159
  • Abstract
    This paper describes our specially designed portable air enclosure for preserving the calculable AC transferring resistor. The inner space of enclosure is 300 mm times 250 mm times 300 mm. Through solving the Laplace equation of heat conduction in sphere region a worthy conclusion is obtained: When the dimension of the layer of temperature homogeneity approaches the geometrical mean of size of the layer of thermal insulation and inner chamber, the inner temperature homogeneity of portable air enclosure is optimal.
  • Keywords
    Laplace equations; heat conduction; packaging; resistors; thermal insulation; AC transferring resistor; Laplace equation; heat conduction; inner chamber; portable air enclosure; temperature homogeneity; thermal insulation; Aluminum; Educational institutions; Instruments; Insulation; Laplace equations; Resistors; Space technology; Stability; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Precision Electromagnetic Measurements Digest, 2008. CPEM 2008. Conference on
  • Conference_Location
    Broomfield, CO
  • Print_ISBN
    978-1-4244-2399-6
  • Electronic_ISBN
    978-1-4244-2400-9
  • Type

    conf

  • DOI
    10.1109/CPEM.2008.4574701
  • Filename
    4574701