Title :
Table of contents
Abstract :
The following topics are dealt with: thermal management; heat spreading; LED packaging; multi-chip-module; stacked die; solders; thermal interface materials; hydrophilicity; hydrophobicity; evaporation; heat pipes; phononics; cooling; heat exchangers; nanoscale heat transport; heat sinks; phase change material; reliability; near junction thermal transport; power electronics and thermoelectrics.
Keywords :
evaporation; heat exchangers; heat pipes; heat sinks; hydrophilicity; hydrophobicity; light emitting diodes; multichip modules; phase change materials; power electronics; reliability; solders; thermal management (packaging); thermoelectric cooling; thermoelectricity; LED packaging; cooling; evaporation; heat exchanger; heat pipe; heat sink; heat spreading; hydrophilicity; hydrophobicity; multichip-module; nanoscale heat transport; near junction thermal transport; phase change material; phononics; power electronics; reliability; solder; stacked die; thermal interface material; thermal management; thermoelectrics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892256
