Title :
A simple thermal model of transformer hot spot temperature based on thermal-electrical analogy
Author :
Xiaoping Su ; Weigen Chen ; Chong Pan ; Qu Zhou ; Li Teng
Author_Institution :
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
Abstract :
The winding hot spot temperature of the oil-immersed power transformer is an important parameter factor in the long-term life of the transformer. It has a great influence on the transformer insulation aging and a close relationship to the transformer top oil temperature which is used to indicate the operating conditions of the transformer. In view of the hot-spot rise over top oil temperature is a function dependent on time as well as the transformer loading, this paper developed a simple thermal model to calculate transformer hot spot temperature based on thermal-electrical analogy, which incorporated the nonlinear thermal resistance and application of oil viscosity and winding losses changes with temperature. The model parameters are estimated by Levenberg-Marquardt method. In the end, The comparison of experimental data under various loadings and model outputs shows the accuracy and efficiency of the proposed model, which suggest that this presented model can describe the thermal behavior of oil-immersed transformer more accurately.
Keywords :
power transformers; transformer oil; transformer windings; Levenberg-Marquardt method; nonlinear thermal resistance; oil viscosity; oil-immersed power transformer; oil-immersed transformer; thermal model; thermal-electrical analogy; transformer hot spot temperature; transformer insulation aging; transformer loading; transformer top oil temperature; winding hot spot temperature; winding losses; Load modeling; Oil insulation; Power transformers; Temperature; Temperature measurement; Thermal analysis; Viscosity; Levenberg-Marquardt method; hot spot temperature; thermal-electrical analogy;
Conference_Titel :
High Voltage Engineering and Application (ICHVE), 2012 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-4747-1
DOI :
10.1109/ICHVE.2012.6357087