Title :
Thermal design guideline of PCB traces under DC and AC current
Author :
Wang, Yi ; de Haan, S.W.H. ; Ferreira, J.A.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
Abstract :
The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today´s PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today´s PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.
Keywords :
current density; printed circuit design; printed circuit testing; thermal analysis; PCB design; PCB traces; current carrying capacity; current density; high frequency current generation; printed circuit board; temperature measurement; thermal design; Printed circuits;
Conference_Titel :
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2893-9
Electronic_ISBN :
978-1-4244-2893-9
DOI :
10.1109/ECCE.2009.5316250