DocumentCode
2277597
Title
BCB (Benzocylcobutene) process integration for the RF passive device
Author
Li, H.Y. ; Tang, M. ; Guo, L.H. ; Lo, G.Q.
Author_Institution
Inst. of Microelectron., Singapore
fYear
2006
fDate
6-8 Dec. 2006
Firstpage
40
Lastpage
45
Abstract
For the on-chip antenna (OCA) application, the authors successful integrate the radio frequency (RF) component (inductor) by the BCB interconnect. The electrical yield of BCB interconnect is more than 80%. The peak Q-value of the inductor that was integrated by BCB interconnects is 36 at frequency 7.78GHz. At the same time, the cost and process time are reduced to half. BCB can be used in the post-process for the RF passive integration.
Keywords
electronics packaging; inductors; integrated circuit interconnections; microwave antennas; radiofrequency integrated circuits; 7.78 GHz; BCB interconnect; BCB process integration; RF passive device; RF passive integration post-process; benzocylcobutene; on-chip antenna application; radio frequency inductor; Annealing; Coatings; Costs; Dielectrics; Inductors; Packaging; Radio frequency; Sputter etching; Sputtering; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location
Singapore
Print_ISBN
1-4244-0664-1
Electronic_ISBN
1-4244-0665-X
Type
conf
DOI
10.1109/EPTC.2006.342688
Filename
4147217
Link To Document