• DocumentCode
    227766
  • Title

    High thermal conductivity ultra-high molecular weight polyethylene (UHMWPE) films

  • Author

    Ghasemi, Hassan ; Thoppey, Nagarajan ; Xiaopeng Huang ; Loomis, James ; Xiaobo Li ; Tong, Junmin ; Jianjian Wang ; Gang Chen

  • Author_Institution
    Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    235
  • Lastpage
    239
  • Abstract
    Recently, high thermally conductive polymers have emerged as low cost and energy efficient alternatives to traditional use of metals in heat transfer applications. Here, we present development of ultra-high molecular weight polyethylene (UHMWPE) thin films with high thermal conductivity. The fabrication platform is based on a sol-gel process followed by mechanical drawing. After gel formation and partial drying, UHMWPE films are mechanically stretched at elevated temperatures, resulting in macroscopic plastic deformation as well as additional polymer chain alignment and crystallization. Both the extrusion and stretching procedures have been automated, and custom software incorporates parameter “recipes” to allow selection of a range of desired process variables. Structural characterization (XRD, DSC, and SEM) of these films suggests highly aligned polymer chains and crystallinity greater than 99%. The Angstrom method is utilized to measure in-plane thermal conductivity of these films along the drawing direction.
  • Keywords
    X-ray diffraction; crystallisation; differential scanning calorimetry; drawing (mechanical); extrusion; gels; plastic deformation; polymer films; scanning electron microscopy; sol-gel processing; thermal conductivity; Angstrom method; DSC; SEM; UHMWPE films; X-ray diffraction; XRD; additional polymer chain alignment; crystallinity; crystallization; custom software; differential scanning calorimetry; extrusion; gel formation; macroscopic plastic deformation; mechanical drawing; partial drying; scanning electron microscopy; sol-gel process; structural characterization; thermal conductivity; ultrahigh molecular weight polyethylene films; Conductivity; Films; Heating; Plastics; Polyethylene; Temperature measurement; Thermal conductivity; polymers; thermal conductivity; ultra-high molecular weight polyethylene;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892287
  • Filename
    6892287