DocumentCode :
227766
Title :
High thermal conductivity ultra-high molecular weight polyethylene (UHMWPE) films
Author :
Ghasemi, Hassan ; Thoppey, Nagarajan ; Xiaopeng Huang ; Loomis, James ; Xiaobo Li ; Tong, Junmin ; Jianjian Wang ; Gang Chen
Author_Institution :
Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
235
Lastpage :
239
Abstract :
Recently, high thermally conductive polymers have emerged as low cost and energy efficient alternatives to traditional use of metals in heat transfer applications. Here, we present development of ultra-high molecular weight polyethylene (UHMWPE) thin films with high thermal conductivity. The fabrication platform is based on a sol-gel process followed by mechanical drawing. After gel formation and partial drying, UHMWPE films are mechanically stretched at elevated temperatures, resulting in macroscopic plastic deformation as well as additional polymer chain alignment and crystallization. Both the extrusion and stretching procedures have been automated, and custom software incorporates parameter “recipes” to allow selection of a range of desired process variables. Structural characterization (XRD, DSC, and SEM) of these films suggests highly aligned polymer chains and crystallinity greater than 99%. The Angstrom method is utilized to measure in-plane thermal conductivity of these films along the drawing direction.
Keywords :
X-ray diffraction; crystallisation; differential scanning calorimetry; drawing (mechanical); extrusion; gels; plastic deformation; polymer films; scanning electron microscopy; sol-gel processing; thermal conductivity; Angstrom method; DSC; SEM; UHMWPE films; X-ray diffraction; XRD; additional polymer chain alignment; crystallinity; crystallization; custom software; differential scanning calorimetry; extrusion; gel formation; macroscopic plastic deformation; mechanical drawing; partial drying; scanning electron microscopy; sol-gel process; structural characterization; thermal conductivity; ultrahigh molecular weight polyethylene films; Conductivity; Films; Heating; Plastics; Polyethylene; Temperature measurement; Thermal conductivity; polymers; thermal conductivity; ultra-high molecular weight polyethylene;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892287
Filename :
6892287
Link To Document :
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