A new EBG structure for < 5 GHz SSN suppression in < 10mm x 10mm high density mixed-signal SIP

In modern mobile hand-held phone, many kinds of wireless services are employed. For example, there are blue tooth, mobile TV, wireless broadband internet, HSDPA, RF-ID, and etc. Since the small-form factor chip set solution corresponding to each wireless service is strongly required in ultra-thin small form-factor mobile phone, system in package (SIP) is promising solution. In mixed signal SIP (MS-SIP) integrating digital logic IC and RF-IC, noise isolation between digital and RF domain is becoming one of major concerns. To manage RF noise propagation, one of recently presented noise suppression design technology is power delivery network (PDN) with electromagnetic band-gap (EBG). In this paper, a new EBG structure employable to small form factor (<10mm times 10mm) MS-SIP is presented.