Packaging technologies for mobile platforms

As electronic devices do more in less space, the technologies that enable them are challenged to do the same. Semiconductor packaging is no exception. As manufacturers attempt to integrate more functionality into slimmer, smaller form factors, advanced packaging, along with SOC integration, is used to reduce the size, cost and power consumption of the integrated circuits inside those mobile devices. New technologies such as multi-die SiP (system-in-package), stacked packages or PoP (package-on-package), packages integrating other packages or PiP (package-in-package), packages that integrate passives with silicon die or LTCC (low temperature co-fired ceramic) and finally redistributive chip packaging (RCP), all promise to improve performance and reduce package sizes. These innovations in IC packaging technology will enable manufacturers of converged products such as smart phones and multimedia players, to create the small, sleek multifunction devices to meet their market demands. However, each of these packaging technologies has trade-offs and benefits that should be carefully evaluated prior to final selection a device packaging solution.