• DocumentCode
    2277811
  • Title

    Surface mobility in silicon at large operating temperature

  • Author

    Reggiani, S. ; Valdinoci, M. ; Colalongo, L. ; Rudan, M. ; Baccarani, G. ; Stricker, A. ; Illien, F. ; Felber, N. ; Fichtner, W. ; Mettler, S. ; Lindenkreuz, S. ; Zullino, L.

  • Author_Institution
    Adv. Res. Center for Electron. Syst., Bologna Univ., Italy
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    15
  • Lastpage
    20
  • Abstract
    An experimental investigation on high-temperature carrier mobility in silicon inversion layers is carried out with the aim of improving our understanding of carrier transport at the onset of second breakdown. Special MOSFET structures suitable for Hall measurements were designed and manufactured using the BCD-3 technology available at ST-Microelectronics. Hall measurements were carried out using a special measurement setup that allows operating temperatures in excess of 400°C to be reached within the polar expansions of a commercial magnet. A novel extraction methodology allowing for the determination of the Hall factor and the carrier mobility against impurity concentration and lattice temperature was devised. Finally, a compact mobility model suitable for implementation in device simulators has been worked out, implemented in the DESSIS© code and validated within an industrial environment.
  • Keywords
    Hall mobility; MOSFET; electron mobility; elemental semiconductors; hole mobility; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; silicon; 400 degC; BCD-3 technology; DESSIS code; Hall factor; Hall measurements; MOSFET structures; Si; carrier mobility; device simulators; high-temperature carrier mobility; impurity concentration; large operating temperature; lattice temperature; mobility model; second breakdown; silicon inversion layers; surface mobility; Electric breakdown; Impurities; Lattices; MOSFET circuits; Manufacturing; Microelectronics; Silicon; Temperature control; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
  • Print_ISBN
    4-89114-027-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2002.1034506
  • Filename
    1034506