Microstructures and characteristics of micro bump connection after ultrasonic flip-chip bonding

Author

Sugimoto, Tetsuya ; Morizono, Yasuhiro ; Ohno, Yasuhide

Author_Institution

Graduate Sch. of Sci. & Technol., Kumamoto Univ.

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

185

Lastpage

189

Abstract

The effectiveness of ultrasonic bonding on the formation of micro bump connection has been investigated on the basis of microstructural observations and bonding characteristics. 216 gold bumps were formed on a silicon substrate by photolithography and plating techniques. Two silicon substrates with such bumps were positioned, and then jointed using commercial bonding machine equipped with ultrasonic transducer. It was found that the sound bond could be achieved between the micro bumps of 25muim times 25mum in size by the control of applied load during the bonding.

Keywords

electronics packaging; flip-chip devices; photolithography; ultrasonic bonding; ultrasonic transducers; 25 micron; commercial bonding machine; flip-chip bonding; micro bump connection; photolithography; ultrasonic bonding; ultrasonic transducer; Bonding; Electronics packaging; Gold; Lithography; Materials science and technology; Microstructure; Packaging machines; Semiconductor device packaging; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342713

Filename

4147242