• DocumentCode
    227810
  • Title

    Effect of hydrodynamic and thermal slip on droplet based thermal management systems

  • Author

    Thalakkottor, Joseph J. ; Mohseni, Kamran

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Univ. of Florida, Gainesville, FL, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    381
  • Lastpage
    387
  • Abstract
    Fluid flow in a microchannel is primarily laminar due to viscous forces dominating over body or inertia forces. Hence fluid circulation in a droplet greatly enhances heat transfer. As a result, slip at a wall-fluid interface could have a two fold affect on heat transfer in droplet based thermal systems; the first is a direct result of thermal slip at the fluid-wall interface, the second is due to hydrodynamic slip at the interface which leads to reduction of internal circulation and in turn reduction in heat transfer. In this paper molecular dynamic simulations are used to look at the effects of thermal and hydrodynamic slip separately and then to investigate the cumulative effect of them on heat transfer in moving droplets in a microchannel. The affect of hydrodynamic slip in an isothermal channel is studied and it is observed that circulation is inversely dependent on slip length. A simple model is established that captures this effect and it also shows that the effect of slip on circulation only becomes important when the length scale of the problem is comparable to the order of slip length.
  • Keywords
    drops; heat transfer; hydrodynamics; microchannel flow; molecular dynamics method; slip flow; thermal management (packaging); droplet based thermal management systems; fluid circulation; fluid flow; heat transfer; hydrodynamic slip; isothermal channel; length scale; microchannel; molecular dynamic simulations; moving droplets; slip length; thermal slip; viscous forces; wall-fluid interface; Heating; Lead;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892306
  • Filename
    6892306