Title :
Thermo-mechanical modelling of power electronics module structures
Author :
Tilford, T. ; Lu, H. ; Bailey, C.
Author_Institution :
Centre for Numerical Modeling & Process Anal., Greenwich Univ., London
Abstract :
Power electronic modules distinguish themselves from other modules by their high power operation. These modules are used extensively in high power application markets such as aerospace, automotive, industrial and traction and drives. This paper discusses typical packaging technologies for power electronics modules. It also discusses the latest results from a UK research project investigating the physics-of-failure approach to reliability analysis and predictions for power modules. An integrated design enviroment for incorporating of affects of uncertainty into the design environment was outlined.
Keywords :
integrated circuit design; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; modules; power integrated circuits; high power operation; integrated design enviroment; packaging technologies; physics-of-failure; power electronics module structures; reliability analysis; thermo-mechanical modelling; uncertainty affects; Aerospace industry; Electromagnetic fields; Fatigue; Multichip modules; Power electronics; Power system reliability; Temperature; Thermal stresses; Thermomechanical processes; Voltage;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342718
