• DocumentCode
    227814
  • Title

    Nature-inspired enhanced microscale heat transfer in macro geometry

  • Author

    Aik Ling Goh ; Kim Tiow Ooi ; Stimming, Ulrich

  • Author_Institution
    Interdiscipl. Grad. Sch., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    397
  • Lastpage
    403
  • Abstract
    To meet the high cooling demand in the electronics industry, enhanced microchannel heat sinks were introduced. However, the intricacies and high costs associated with microfabrication technologies prove them unsuitable for application in conventional heat exchangers. Hence, the motivation to implement microscale passages in macro geometries ensues. In this study, the annular microchannel is formed by securing a cylindrical insert of mean diameter 19.4 mm concentrically within a cylindrical pipe of internal diameter 20 mm. The paper looks at heat transfer enhancement techniques using inserts of nature-inspired profiles. CFD simulations based on conventional theory were carried out to predict the heat transfer and flow characteristics in the microchannel, for length of 30 mm, mean hydraulic diameter of 600 μm, and under constant heat input of 500 W. Under flow condition of 4 L/min (0.0667 kg/s), convective heat transfer coefficient values of 33.7, 32.7, 30.4 and 26.2 kW/m2·K are obtained for the Durian, Inverted Fish Scale, Fish Scale and Plain profiles respectively. This corresponds to an enhancement of 29%, 25% and 16% respectively, relative to the Plain profile. In addition, using Inverted Fish Scale profile, flow condition of 8 L/min (0.133 kg/s) yield a significant convective heat transfer coefficient value of 59.2 kW/m2·K. The pressure drop values are found to be easily met by a commercially available pump.
  • Keywords
    computational fluid dynamics; cooling; electronics industry; heat exchangers; heat sinks; microchannel flow; microfabrication; natural convection; thermal management (packaging); CFD simulations; annular microchannel; convective heat transfer coefficient values; cooling demand; cylindrical pipe; durian profiles; electronics industry; flow characteristics; heat exchangers; heat transfer characteristics; heat transfer enhancement techniques; inverted fish scale profiles; macrogeometry; mean hydraulic diameter; microchannel heat sinks; microfabrication technologies; microscale passages; nature-inspired enhanced microscale heat transfer; plain profile; power 500 W; size 19.4 mm; size 20 mm; size 600 mum; Atmospheric modeling; Fluids; Heat transfer; Heating; Marine animals; Mathematical model; Microchannels; Microchannel; biomimicry; computational fluid dynamics; enhanced; single-phase;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892308
  • Filename
    6892308