DocumentCode :
2278168
Title :
Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly
Author :
Wang, Tong Hong ; Lai, Yi Shao ; Wang, Meng Jen
Author_Institution :
Adv. Semicond. Eng., Inc., Kaohsiung
fYear :
2006
fDate :
6-8 Dec. 2006
Firstpage :
233
Lastpage :
236
Abstract :
Experimental and numerical studies were conducted to investigate Cu/low-k delamination potentials of a flip-chip package assembly implemented with different underfills under an accelerated thermal cycling test condition. A total of six underfills were considered and compared. Their temperature-dependent Young´s moduli, coefficients of thermal expansion, and glass transition temperatures were measured and incorporated in the finite element model. The numerical predictions were benchmarked by actual thermal cycling test results. Results indicate that the first principal stress at the die edge shows a good correlation with Cu/low-k delamination potentials observed from experiments.
Keywords :
Young´s modulus; copper; delamination; finite element analysis; flip-chip devices; temperature measurement; thermal expansion; Cu; Young modulus; delamination risk; finite element model; flip-chip package assembly; temperature measurement; thermal cycling test; thermal expansion coefficient; underfill selection; Assembly; Delamination; Finite element methods; Glass; Life estimation; Packaging; Temperature measurement; Testing; Thermal conductivity; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
Type :
conf
DOI :
10.1109/EPTC.2006.342721
Filename :
4147250
Link To Document :
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