Heat transfer analysis of vapor chamber heat pipe for high power LED package

In this paper, the high power LED system dissipation equipment is analyzed, in this LED system,consisting of nine chips and each chip is 3W. The novel dissipation equipment is design and analyzed, which is composed of vapor chamber, heat pipe array and fins. Vapor chamber as the thermal diffusion layer, it is effectively reduces the spreading resistance from LED chips to heat pipe. The other two models were built as the comparison. The designs were then being calculated on its transfer behavior using simulation with professional thermal analysis software Flotherm, simulation results show that the novel design has better heat dissipation ability than the other two comparison models, and the junction temperature is 71.6°C at the natural convection condition, after optimization of the fins, it is drop to 65.6°C.