Title :
Extraction of 3D interconnect impedances using edge elements without gauge condition
Author :
Charlet, F. ; Carpentier, J.F.
Author_Institution :
Lab d´´Electron. et de Technol. de l´´Inf., CEA, Centre d´´Etudes Nucleaires de Grenoble, France
Abstract :
We present an efficient simulation method for the extraction of frequency dependent interconnect impedances. Our method is based on a symmetrical (A,T) system approximated by the use of edge finite elements. It doesn´t need gauge conditions and the matrix system has good convergence properties. Qualitative results on eddy current and return current effects are presented and a first numerical validation is made.
Keywords :
SPICE; convergence of numerical methods; digital simulation; electric impedance; finite element analysis; integrated circuit interconnections; integrated circuit modelling; 3D interconnect impedance extraction; A-T formulation; convergence properties; eddy current effects; edge approximation; edge finite elements; efficient simulation method; finite element method; frequency dependence; matrix system; meshing; numerical validation; return current effects; separated grids; software performance; symmetrical (A,T) system; Conductors; Convergence; Electric potential; Finite element methods; Frequency; Impedance; Integrated circuit interconnections; Magnetic domains; Magnetic separation; Symmetric matrices;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
Print_ISBN :
4-89114-027-5
DOI :
10.1109/SISPAD.2002.1034537
