DocumentCode :
2278443
Title :
Modeling of ultra shallow junctions and hybrid source/drain profiles annealed by soak and spike RTA
Author :
Wang, C.C. ; Chang, C.S. ; Griffin, Peter ; Diaz, C.H.
Author_Institution :
Adv. Device Technol., Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
fYear :
2002
fDate :
2002
Firstpage :
151
Lastpage :
154
Abstract :
We discuss the 1D/2D modeling of arsenic profiles under soak and spike anneal conditions at both shallow extension and high concentration source/drain areas. This work also addresses the calibration of the phosphorus profile in a hybrid (arsenic + phosphorus) source/drain with various anneal temperatures. It is shown that the "+1" or modified "+n" model is not necessary for shallow arsenic profile modeling under spike anneal conditions. Finally, it is also shown that modeling of the hybrid source/drain profile can be achieved by optimization of the dopant\´s Fermi level dependent diffusivity, initial value of point defects concentration at equilibrium state, and neglect of implant induced damage.
Keywords :
Fermi level; MOSFET; arsenic; diffusion; doping profiles; interstitials; phosphorus; rapid thermal annealing; semiconductor device models; vacancies (crystal); Fermi level; NMOSFET; annealing; arsenic profiles; diffusivity; hybrid source/drain profiles; phosphorus profile; point defect concentration; soak RTA; spike RTA; ultra shallow junctions; Annealing; CMOS technology; Calibration; Doping profiles; Hybrid junctions; Implants; Pulp manufacturing; Research and development; Semiconductor process modeling; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
Print_ISBN :
4-89114-027-5
Type :
conf
DOI :
10.1109/SISPAD.2002.1034539
Filename :
1034539
Link To Document :
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