Application of FEM simulation technology on thermal design of electronic packaging device

Thermal design is necessarily to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of packaging device was studied using FEM, for example, phase shifter and LED. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simulation shows tendency as tested experiment results, verifying the correctness of the simulation model and method used. The relation of relative temperature rising to different solder voids, substrate thickness and material is studied by simution. The quantitative relations of these parameters and temperature provided a theoretical basis for the thermal design, the optimization of parameters and the reliability improvement of phase shifter and LED.