• DocumentCode
    2278717
  • Title

    Genetic-algorithm- annealing-algorithm-based scheme for MCM interconnect test

  • Author

    Lei, Chen

  • Author_Institution
    Guilin Univ. of Electron. Technol., Guilin, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    973
  • Lastpage
    976
  • Abstract
    A novel optimization scheme based on genetic algorithm (GA) and simulated annealing algorithm (SA) is presented for the Multi-chip Module (MCM) interconnect test generation problem in this paper. The pheromone updating rule and state transition rule of ACA is designed for automatic test generation by combing the characteristics of MCM interconnect test. GA generates the initial candidate test vectors by utilizing genetic operator. In order to get the best test vector with the high fault coverage, SA is employed to evolve the candidates generated by GA. By using this scheme, the ideal searching direction of global optimal solution could be found as soon as possible and the convergence speed of GA was also improved, while the shortcomings of high initial temperature required and slow convergence speed of SA were also overcame. The international standard MCM benchmark circuit was used to verify the approach. Comparing with not only the evolutionary algorithms, but also the deterministic algorithms, simulation results indicate that this optimization scheme can achieve high fault coverage, compact test set and short execution time.
  • Keywords
    automatic test pattern generation; circuit optimisation; genetic algorithms; integrated circuit interconnections; integrated circuit testing; multichip modules; simulated annealing; MCM benchmark circuit; automatic test generation; genetic algorithm; global optimal solution; interconnect test generation; multichip module; optimization scheme; searching direction; simulated annealing algorithm; Algorithm design and analysis; Circuit faults; Convergence; Integrated circuit interconnections; Integrated circuit modeling; Simulated annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582639
  • Filename
    5582639