"What can computer aided engineering do for the SoC era ?"

TCAD has contributed to processldevice design and prediction of the device performances for decades. This role is still very important in very deep submicron process; however, new aspect in the semiconductor industry has arisen. Interconnect issue becomes more critical in SoC timing closure. ITRS roadmap predicts future of processldevices and interconnects, which lead to a standardized process and device. TCAD seems to be requested to contribute in the new situation of SoC era. The panel addresses topics such as: What is the new role of TCAD in SoC era? How TCAD can contribute towards the ultimate-solution in timing closure problem. How to attack SI(Signa1 Integrity) Physical Design by TCAD. Can TCAD make innovation on Process & Device, which changes the ITRS2001?