DocumentCode
2278757
Title
Collaborative simulation analysis and research of coupled electromagnetic-thermal field of cable bundles
Author
Quanyong, Wang ; Zhaohua, Wu
Author_Institution
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
961
Lastpage
964
Abstract
As the information transmission medium widely used in the electronic equipment 3D interconnection, cables have many advantages, such as flexible routing, little electromagnetic interference, and highly cost effective, so they have an irreplaceable position for information transmission. In order to keep cables orderly and maintain easily, they are often packed in parallel row or cylindrical row as cable bundles. On the other hand, packing induces space between cables smaller. So the electromagnetic crosstalk and heat effect will become more serious. With the deteriorating of work environment and the improvement of reliability standards, electronic equipments should not only meet the standards of electromagnetic compatibility, but also should be able to maintain excellent work performance under the environment of electric, magnetic, temperature, stress field and other multi-physics field. Therefore, there is great significance for enhancing the ability of electronic equipment to adapt complex working environments, through studying on electromagnetic-thermal coupling collaborative simulation and analysis of cable bundles in electric equipments. In this paper, based on the theories of electromagnetic compatibility, temperature field and electromagnetic-thermal coupling, the crosstalk and temperature rise impacted by bundling methods and allocation plans are studied. The study is simulated collaboratively with HFSS and ePhysics. The electromagnetic analysis of cable bundles is simulated with HFSS, and the same simulation model and the meshing results generated by HFSS are used to simulate collaboratively with ePhysics. In the collaborative simulation process, the electromagnetic power loss density generated by HFSS is automatically mapped to electromagnetic-thermal coupling analysis with ePhysics, after above the collaborative simulation of electromagnetic field and thermal field is completed. Through the collaborative simulation, we can get cable bundles´ performances - - of crosstalk and thermal. By comparing the simulation results, some guiding principles of routing are proposed at last.
Keywords
cables (electric); electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; integrated circuit interconnections; integrated circuit reliability; 3D interconnection; HFSS; cable bundles; collaborative simulation process; ePhysics; electromagnetic compatibility; electromagnetic crosstalk; electromagnetic field; electromagnetic interference; electromagnetic power loss density; electromagnetic thermal coupling; electronic equipment; information transmission medium; reliability standards; thermal field; Analytical models; Arrays; Collaboration; Crosstalk; Electromagnetics; Land surface temperature; Routing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582641
Filename
5582641
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