Title :
Elastoplastic harmonic analysis of board-level swept sine vibration tests
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng. Inc., Kaohsiung
Abstract :
The authors derive in this paper equations of motion of board-level electronic packages subjected to swept sine vibration loads following the support excitation scheme. A single degree of freedom elastoplastic structural system is constructed to benchmark multi-step harmonic analysis schemes proposed in this study. Applications of the harmonic analysis schemes to calculating response spectra of a board-level test vehicle that contains elastoplastic solder joints are also demonstrated.
Keywords :
copper alloys; dynamic testing; elastoplasticity; electronics packaging; harmonic analysis; nickel alloys; silver alloys; solders; tin alloys; SnAgCuNi; board-level electronic packages; elastoplastic harmonic analysis; elastoplastic solder joints; swept sine vibration tests; Electronic equipment testing; Fatigue; Frequency; Harmonic analysis; Life estimation; Packaging; Performance evaluation; Soldering; Stress; Vehicles;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342754
