Title :
Vertically interconnected 3D module for conformal phased array antennas
Author :
Liu, Bosui ; Wang, Yu Albert ; Kang, George ; Ferendeci, Altan M. ; Mah, Misoon
Author_Institution :
Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA
Abstract :
The development of a basic X-band 3D-IC/MEMS microwave transmit module is investigated for the possibility of conformal phased array technology. An innovative approach using microelectronics and MEMS processing technologies is implemented to develop 3D-IC processing technology. This allows us to investigate the technology development needed for minimum module depth to enable distribution on any arbitrary surface. For the initial phase, as a demonstration vehicle, a basic passive transmit module is designed, fabricated and characterized at microwave frequencies
Keywords :
MMIC; antenna phased arrays; conformal antennas; micromechanical devices; microwave antenna arrays; transmitting antennas; 3D-IC processing; MEMS processing; X-band module; conformal antennas; fabrication; microelectronics; microwave frequencies; microwave transmit module; module depth; passive transmit module; phased array antennas; vertically interconnected 3D module; Aircraft; Antenna arrays; Dielectric substrates; Integrated circuit interconnections; Micromechanical devices; Microwave antenna arrays; Microwave technology; Phased arrays; Planar arrays; Power transmission lines;
Conference_Titel :
Phased Array Systems and Technology, 2000. Proceedings. 2000 IEEE International Conference on
Conference_Location :
Dana Point, CA
Print_ISBN :
0-7803-6345-0
DOI :
10.1109/PAST.2000.858907
