Vertically interconnected 3D module for conformal phased array antennas

Author

Liu, Bosui ; Wang, Yu Albert ; Kang, George ; Ferendeci, Altan M. ; Mah, Misoon

Author_Institution

Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA

fYear

2000

fDate

2000

Firstpage

49

Lastpage

52

Abstract

The development of a basic X-band 3D-IC/MEMS microwave transmit module is investigated for the possibility of conformal phased array technology. An innovative approach using microelectronics and MEMS processing technologies is implemented to develop 3D-IC processing technology. This allows us to investigate the technology development needed for minimum module depth to enable distribution on any arbitrary surface. For the initial phase, as a demonstration vehicle, a basic passive transmit module is designed, fabricated and characterized at microwave frequencies

Keywords

MMIC; antenna phased arrays; conformal antennas; micromechanical devices; microwave antenna arrays; transmitting antennas; 3D-IC processing; MEMS processing; X-band module; conformal antennas; fabrication; microelectronics; microwave frequencies; microwave transmit module; module depth; passive transmit module; phased array antennas; vertically interconnected 3D module; Aircraft; Antenna arrays; Dielectric substrates; Integrated circuit interconnections; Micromechanical devices; Microwave antenna arrays; Microwave technology; Phased arrays; Planar arrays; Power transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Phased Array Systems and Technology, 2000. Proceedings. 2000 IEEE International Conference on

Conference_Location

Dana Point, CA

Print_ISBN

0-7803-6345-0

Type

conf

DOI

10.1109/PAST.2000.858907

Filename

858907