Title :
MEMS on bulk mechanical contour substrates
Author :
Li, Wen J. ; Ho, Chih-Ming
Author_Institution :
Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
Abstract :
We have fabricated MEMS structures directly onto non-silicon bulk cylindrical substrates with minimum linewidth resolution better than 5 μm. Simple sacrificially released metal structures were realized on a 1.25" diameter, 2" long cylinder surface which demonstrated our alignment process for making multiple layers of thin film micro-structures. We have also initiated work to fabricate MEMS sensors and actuators onto bulk cylindrical substrates and the preliminary results are presented in this paper
Keywords :
masks; microactuators; micromechanical devices; microsensors; photolithography; substrates; 1.25 in; 2 in; 5 micron; MEMS actuators; MEMS sensors; MEMS structures fabrication; alignment process; bulk cylindrical substrates; bulk mechanical contour substrates; nonsilicon substrates; sacrificially released metal structures; thin film microstructures; Actuators; Automotive components; Computerized monitoring; Condition monitoring; Fabrication; Mechanical sensors; Microelectromechanical devices; Micromechanical devices; Optical films; Substrates;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635733
