An advanced data acquisition system for microprocessor package thermal characterization

This paper describes the development of an advanced data acquisition test system for the thermal characterization of microprocessor packages. The system can power up multiple blocks at different rates, source and sense multi-thermal diodes, sense multiple thermal couples for the temperature measurement of the ambient air, peltier cold plate, heat sink base and etc. The data acquisition system consists of digital multimeters, source meter, power supplies, switching unit and specific boards. A LabVIEW program was developed to run the hardware as well as to capture the data. The calibration oven and the thermal test platform were upgraded with new test board fixture and connectors to interface with the advanced data acquisition test system. To solve the wiring issues caused by the multiple sensing, two-wire connection scheme for diode was validated and applied in the system. Advanced thermal characterization was performed with the thermal test vehicles under three typical power patterns with all the cells being sourced and sensed. The results revealed a more detailed thermal profile over the silicon die and such details will be helpful with thermal design and solutions for the microprocessor packages