Title :
Improved thermal modeling techniques for bond wires in CFD
Author :
Satchidanandan, Shankar ; Shidore, Sarang
Author_Institution :
Flomerics India Pvt. Ltd., Bangalore
Abstract :
The paper investigates the accuracy and computational efficiency of various thermal modeling approaches for bond-wires in wire bonded packages. It recommends an improved thermal modeling technique for thermal designers that can be implemented in their work. The significance of the thermal impact of bond-wires in IC packages is also demonstrated
Keywords :
computational fluid dynamics; integrated circuit packaging; lead bonding; thermal management (packaging); CFD; IC packages; bond wires; thermal modeling techniques; wire bonded packages; Bonding; Computational fluid dynamics; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device packaging; Solid modeling; Surface resistance; Temperature; Testing; Wires;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342761
