DocumentCode
2278944
Title
Improved thermal modeling techniques for bond wires in CFD
Author
Satchidanandan, Shankar ; Shidore, Sarang
Author_Institution
Flomerics India Pvt. Ltd., Bangalore
fYear
2006
fDate
6-8 Dec. 2006
Firstpage
482
Lastpage
486
Abstract
The paper investigates the accuracy and computational efficiency of various thermal modeling approaches for bond-wires in wire bonded packages. It recommends an improved thermal modeling technique for thermal designers that can be implemented in their work. The significance of the thermal impact of bond-wires in IC packages is also demonstrated
Keywords
computational fluid dynamics; integrated circuit packaging; lead bonding; thermal management (packaging); CFD; IC packages; bond wires; thermal modeling techniques; wire bonded packages; Bonding; Computational fluid dynamics; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device packaging; Solid modeling; Surface resistance; Temperature; Testing; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location
Singapore
Print_ISBN
1-4244-0664-1
Electronic_ISBN
1-4244-0665-X
Type
conf
DOI
10.1109/EPTC.2006.342761
Filename
4147290
Link To Document