On the thermal stability margins of high-leakage current packaged devices

In this paper, a graphical approach of fixed-point iteration is proposed to study the thermal stability of high leakage current, packaged devices. Following this approach, we can obtain the thermal properties of the device, and the margin the system has towards a thermal runaway point. Transient simulations with temperature-dependent power dissipations are also carried out to verify the validity of this approach. The impact of various factors on the thermal behavior are investigated, including ambient temperature, thetas_JA of the package and the power consumption.