• DocumentCode
    2278968
  • Title

    Application of TCAD to designing advanced DRAM and logic devices

  • Author

    Fukuda, I. ; Nishi, K.

  • Author_Institution
    VLSI R&D Centre, OKI Electr. Ind. Co. Ltd., Tokyo, Japan
  • fYear
    1997
  • fDate
    8-10 Sept. 1997
  • Firstpage
    17
  • Lastpage
    20
  • Abstract
    Typical aspects of applying TCAD to designing advanced DRAM and logic devices are presented focusing on transistors. For prediction at the start of developing new devices, global models which fit marginally to varieties of transistors are used. After preliminary experiments of the new devices, model parameters are best fit to the experimental results using local parameter extractions. These local models are used for process optimization of the devices under development. Response surface models are extensively used with additional information of weighted optimization and statistical analysis. Fast and compact contributions to circuit design are promised by response surfaces of SPICE parameters. A new concept of response surface chains (RSC) is introduced to make the best use of simulated results. Support of TCAD tools to this concept is a key technology for concurrent and real-time development of the advanced devices.
  • Keywords
    DRAM chips; SPICE; circuit CAD; integrated circuit design; logic CAD; logic design; logic devices; DRAM; SPICE; TCAD; circuit design; concurrent real-time development; global model; local model; logic device; parameter extraction; process optimization; response surface chain; response surface model; statistical analysis; transistor; weighted optimization; Circuit synthesis; Logic devices; Parameter extraction; Predictive models; Random access memory; Response surface methodology; SPICE; Statistical analysis; Surface fitting; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
  • Conference_Location
    Cambridge, MA, USA
  • Print_ISBN
    0-7803-3775-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.1997.621325
  • Filename
    621325