DocumentCode
2278968
Title
Application of TCAD to designing advanced DRAM and logic devices
Author
Fukuda, I. ; Nishi, K.
Author_Institution
VLSI R&D Centre, OKI Electr. Ind. Co. Ltd., Tokyo, Japan
fYear
1997
fDate
8-10 Sept. 1997
Firstpage
17
Lastpage
20
Abstract
Typical aspects of applying TCAD to designing advanced DRAM and logic devices are presented focusing on transistors. For prediction at the start of developing new devices, global models which fit marginally to varieties of transistors are used. After preliminary experiments of the new devices, model parameters are best fit to the experimental results using local parameter extractions. These local models are used for process optimization of the devices under development. Response surface models are extensively used with additional information of weighted optimization and statistical analysis. Fast and compact contributions to circuit design are promised by response surfaces of SPICE parameters. A new concept of response surface chains (RSC) is introduced to make the best use of simulated results. Support of TCAD tools to this concept is a key technology for concurrent and real-time development of the advanced devices.
Keywords
DRAM chips; SPICE; circuit CAD; integrated circuit design; logic CAD; logic design; logic devices; DRAM; SPICE; TCAD; circuit design; concurrent real-time development; global model; local model; logic device; parameter extraction; process optimization; response surface chain; response surface model; statistical analysis; transistor; weighted optimization; Circuit synthesis; Logic devices; Parameter extraction; Predictive models; Random access memory; Response surface methodology; SPICE; Statistical analysis; Surface fitting; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location
Cambridge, MA, USA
Print_ISBN
0-7803-3775-1
Type
conf
DOI
10.1109/SISPAD.1997.621325
Filename
621325
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