Title :
Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques
Author :
Wang, Shuming T. ; Xie, Zhi-Feng ; Liu, Tzu-Te ; Hwang, Rey-Chue
Author_Institution :
I-Shou Univ., Kaohsiung
Abstract :
Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.
Keywords :
Global Positioning System; electronics packaging; lumped parameter networks; neural nets; radiofrequency filters; surface acoustic wave filters; GPS system; RF SAW filter; SAW simulation; bonding pads; electronic packaging; full wave EM simulator; lumped element package model; neural networks; radio frequency surface acoustic wave device; Acoustic waves; Bonding; Circuit simulation; Global Positioning System; Neural networks; Packaging; Radio frequency; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Lumped Element Model; Neural Network; Package Effect; RF SAW;
Conference_Titel :
Applications of Ferroelectrics, 2007. ISAF 2007. Sixteenth IEEE International Symposium on
Conference_Location :
Nara
Print_ISBN :
978-1-4244-1334-8
Electronic_ISBN :
1099-4734
DOI :
10.1109/ISAF.2007.4393395
