Nanoindentation study of sputtered Al-Cu thin films for interconnect applications

Author

Kumar, Amit ; Jayaganthan, R. ; Chandra, Ramesh ; Chawla, Vipin ; Tay, A.A.O.

Author_Institution

Dept. of Metall. & Mater. Eng., Indian Inst. of Technol., Roorkee

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

560

Lastpage

564

Abstract

Al-Cu thin films were deposited by DC-magnetron sputtering. The formation of different phases and microstructures of Al-Cu thin films were characterised by using XRD and AFM technqiues. The mechanical properties of the Al-Cu thin films were measured by CSEM Nanoindentation technique. It was found that the higher hardness and Young modulus of Al-Cu thin films is due to presence of precipitate and ductile phases in the film. The nanosized grain morphology improves the strength of Al-Cu thin film significantly

Keywords

X-ray diffraction; Young´s modulus; aluminium compounds; atomic force microscopy; copper compounds; integrated circuit interconnections; sputtering; AFM; Al-Cu; CSEM nanoindentation technique; DC-magnetron sputtering; XRD; Young´s modulus; interconnect applications; nanoindentation study; nanosized grain morphology; sputtered thin films; Copper; Instruments; Mechanical factors; Microstructure; Plastic films; Sputtering; Substrates; Testing; Thin film devices; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342774

Filename

4147303