CAD/CAM software framework design for the laser micromachining device driven by two stages

Laser processing has emerged in the last few years as the most widely accepted method of creating micro-vias in high-density electronic interconnect and chip packaging devices. This paper reports one kind of UV laser machine tool which has been applied to LTCC mass production lines and suitable for drilling micro-vias and cutting cavities for green tape with high productivity and high accuracy. It puts emphasis on the CAD/CAM software framework design for the described UV laser machine, which can overcome the challenges that the so-called compound laser beam positioning system driven by two stages brings to the software design. Some data processing techniques including scan field dividing, tool path generation, and scanner post processing, are presented.