Title :
Exploring the ulthimo platform
Author :
De Samber, Marc ; Tak, Coen ; Peels, Wil
Author_Institution :
Philips Appl. Technol., Eindhoven
Abstract :
A substrate level (matrix) single die packaging technology is used as the basis for an electronic packaging platform. This Ulthimo (ultra thin multi die outline) or nowadays called UTLP (ultra thin leadless package) technology was originally developed for high frequency transistor packaging. Onto its core process flow dedicated process modules are added to enable its use for packaging of more complex functionalities. The added process modules are chosen such that they fit on the base process flow without jeopardizing these base process steps. The platform based applications are multi-die packaging including vertical dies, 3-dimensional sensor packaging and biofluidic packaging
Keywords :
electronics packaging; modules; Ulthimo platform; base process flow; core process flow; electronic packaging platform; high frequency transistor packaging; multidie packaging; single die packaging technology; ultra thin leadless package technology; ultra thin multidie outline platform; Biosensors; Costs; Electronics packaging; Frequency; Packaging machines; Plastic packaging; Semiconductor device packaging; Substrates; System-on-a-chip; Visualization;
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
DOI :
10.1109/EPTC.2006.342780
