• DocumentCode
    2279521
  • Title

    IN/INS shorting due to surface ESD

  • Author

    Llamas, Corazon

  • Author_Institution
    Philips Semicond., Calamba
  • fYear
    2006
  • fDate
    6-8 Dec. 2006
  • Firstpage
    684
  • Lastpage
    687
  • Abstract
    As semiconductor devices becomes smaller and smaller, more complex and sensitive to ESD, the manufacturing process gets more difficult. Manufacturing equipment should be ready for this kind of phenomenon and companies should be aware that surface ESD could happen at their production line. Though there are current ESD controls and knowledge of the classical ESD models, these may not be sufficient enough to comprehend the new ESD failure model. An increasing trend in customer complaint due to IN/INS shorting triggered the team to come-up with corrective/preventive action to eliminate this problem. Employing Philips\´ MEDIC approach and use of statistical engineering tool we were able to define an action to prevent occurrence of such phenomenon. The team achieved a reduction in DC fails, zero customer complaints and a priceless benefit... "customer delight".
  • Keywords
    electrostatic discharge; integrated circuit packaging; IN/INS shorting; statistical engineering tool; surface ESD; Collaboration; Electrostatic discharge; Manufacturing industries; Manufacturing processes; Passivation; Production; Semiconductor device manufacture; Semiconductor devices; Surface cracks; Surface discharges;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0664-1
  • Electronic_ISBN
    1-4244-0665-X
  • Type

    conf

  • DOI
    10.1109/EPTC.2006.342796
  • Filename
    4147325