Reliability of flip chip on flexible substrates under drop impact

Flip chip technology has attracted much attention in electronic industry as it fills the need for low cost, miniaturization and high performance requirements of electronic products. For such devices, package reliability under drop impact is a great concern to the manufacturers as these electronic packages are very much vulnerable to solder joint failures caused by the mechanical shock and the PCB warping upon impact. This study is performed to compare behavior of flip-chip on rigid as well as flexible substrate with and without underfill when subjected to multiple drop impact. Parametric study with variable die thickness under drop impact is also performed. Von misses stresses and equivalent plastic strain developed on electronic package when subjected to multiple drop impact are assessed and compared using Finite Element Analysis (FEA).