Modeling and characterization of the bonding-wire interconnection for microwave MCM

The 3-D electromagnetic software Ansoft HFSS is adapted to modeling analysis and simulation optimization about the microwave characteristics of bonding interconnection in the MMCM. The gold bond model contained micro strip is set up to emulate and optimize for insertion loss (IL) and return loss (RL), according to the major parameters such as arch highness, span and the root of the number of gold. Micro strip model of three roots copper wire connection is established to analyses the difference between microwave characteristics of the golden and copper. The results showed that arch highness of bonding gold wire is the lower the better in the case of singles gold and the same span. The span of bonding gold wire is the shorter the better in the case of singles gold and the same arch highness. It should be as far as possible bond 2 or 3 roots gold if the chip welding area allowed. Copper wire has shown better microwave properties than gold in the area of return loss and insertion loss.