Impact of hygroswelling and vapor pressure on delamination

In this paper, resolving methods for several key issues in simulation of interface delamination of plastic package under temperature and humidity environment are discussed. Structural model of plastic package under temperature and humidity is constructed, and the coupling of the thermal and moisture impact on structure field is implemented. The method of determining the vapor pressure in crack during process of solder reflow is presented. The precondition processes of moisture absorption and solder reflow of a real package are simulated, and the results of finite element model are analyzed with mixed mode fracture and interface cracking.