DocumentCode :
2279771
Title :
Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach
Author :
Belmehdi, Y. ; Azzopardi, S. ; Deletage, J.-Y. ; Woirgard, E.
Author_Institution :
IMS Lab., Univ. of Bordeaux, Talence, France
fYear :
2009
fDate :
20-24 Sept. 2009
Firstpage :
3942
Lastpage :
3947
Abstract :
Power devices in their environmental application are submitted in addition to the electrical, thermal, radiation and other kinds of stresses to mechanical stress. In our study, we focus in combination of electrical, thermal and mechanical stresses of a Trench Gate punch through insulated gate bipolar transistor during switching transients. With a 2D physically-based finite elements simulator, we can achieve electro-thermo-mechanical simulations. Two operating configurations have been analyzed: inductive switching and short circuit. Simulation results show that whereas the mechanical stress has low effect on the current tail during clamped inductive switching turn off and on the sustain voltage during unclamped inductive switching, the saturation current during short-circuit operating is strongly affected by external mechanical stress depending on its level, direction and nature (compressive or tensile).
Keywords :
finite element analysis; insulated gate bipolar transistors; internal stresses; power semiconductor devices; semiconductor device models; Trench IGBT; Trench gate punch through insulated gate bipolar transistor; clamped inductive switching; electro-thermo-mechanical simulation; finite elements simulation; power devices; saturation current; switching transients; uni-axial mechanical stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2893-9
Electronic_ISBN :
978-1-4244-2893-9
Type :
conf
DOI :
10.1109/ECCE.2009.5316371
Filename :
5316371
Link To Document :
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