Electrical simulation research for IC package gold bonding wire

With the development of semiconductor technology, the IC frequency become higher and higher, and the IC package become more and more importance. Currently, the wiring bonding is mainly used to connect die and package pads, so parasitical parameter of bonding wire must be considered especially for RFIC and MMIC component. It was discussed by finite element simulation and analysis in this paper that the different standard gold bonding wires have different effects on the parasitical parameter and the electrical performance of one ideal amplifier.