DocumentCode
227996
Title
A review of challenging issues in the integration of absorption refrigeration and organic Rankine Cycle into a data center cooling system
Author
Ebrahimi, Khosrow ; Jones, Glenn ; Fleischer, Avner
Author_Institution
Dept. of Mech. Eng., Villanova Univ., Villanova, PA, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1047
Lastpage
1054
Abstract
Our theoretical studies showed that absorption refrigeration (AR) system and organic Rankine cycle (ORC) are the most promising technology candidates in utilizing the waste heat dissipated by data centers. Since both candidates work with heat of temperatures not less than ~65°C, this study is limited to water-cooled and hybrid two-phase cooled data centers. However, there exist challenges in the integration of these technologies into the data center design. The first issue is the scale at which the waste heat is extracted and recovered. Although the range of this scale can be from a single server to multiple racks, heat input of equipment required by AR and ORC manufacturers is the main limitation. The second issue is the method of transporting extracted waste heat from chip to either the generator of AR or the evaporator of ORC with minimum degradation of heat quality. In this paper the major focus is on the first issue.
Keywords
Rankine cycle; computer centres; cooling; heat recovery; network servers; power aware computing; refrigeration; thermal management (packaging); waste heat; AR system; ORC; absorption refrigeration; data center cooling system; heat quality degradation; hybrid two-phase cooled data centers; multiple racks; organic Rankine cycle; waste heat dissipation; waste heat extraction; waste heat recovery; water-cooled data centers; Absorption; Cooling; Generators; Heat recovery; Servers; Waste heat; Coefficient of Performance; absorption refrigeration; data center; efficiency; integration; liquid cooling; novel heat recovery system; organic Rankine cycle; two-phase cooling; waste heat recovery;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892397
Filename
6892397
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