• DocumentCode
    227996
  • Title

    A review of challenging issues in the integration of absorption refrigeration and organic Rankine Cycle into a data center cooling system

  • Author

    Ebrahimi, Khosrow ; Jones, Glenn ; Fleischer, Avner

  • Author_Institution
    Dept. of Mech. Eng., Villanova Univ., Villanova, PA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1047
  • Lastpage
    1054
  • Abstract
    Our theoretical studies showed that absorption refrigeration (AR) system and organic Rankine cycle (ORC) are the most promising technology candidates in utilizing the waste heat dissipated by data centers. Since both candidates work with heat of temperatures not less than ~65°C, this study is limited to water-cooled and hybrid two-phase cooled data centers. However, there exist challenges in the integration of these technologies into the data center design. The first issue is the scale at which the waste heat is extracted and recovered. Although the range of this scale can be from a single server to multiple racks, heat input of equipment required by AR and ORC manufacturers is the main limitation. The second issue is the method of transporting extracted waste heat from chip to either the generator of AR or the evaporator of ORC with minimum degradation of heat quality. In this paper the major focus is on the first issue.
  • Keywords
    Rankine cycle; computer centres; cooling; heat recovery; network servers; power aware computing; refrigeration; thermal management (packaging); waste heat; AR system; ORC; absorption refrigeration; data center cooling system; heat quality degradation; hybrid two-phase cooled data centers; multiple racks; organic Rankine cycle; waste heat dissipation; waste heat extraction; waste heat recovery; water-cooled data centers; Absorption; Cooling; Generators; Heat recovery; Servers; Waste heat; Coefficient of Performance; absorption refrigeration; data center; efficiency; integration; liquid cooling; novel heat recovery system; organic Rankine cycle; two-phase cooling; waste heat recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892397
  • Filename
    6892397