Thermal characterization of the IGBT modules used in hybrid electric vehicles

Author

Lambate, Harichandra ; Nakanekar, Satej ; Tonapi, Sandeep

Author_Institution

Anveshak Technol. & Knowledge Solutions, Pune, India

fYear

2014

fDate

27-30 May 2014

Firstpage

1086

Lastpage

1091

Abstract

In the present investigation, steady state thermal analysis of IGBT 6-pack power modules is carried out to keep maximum temperature within permissible limit. Quality and reliability of an IGBT module depends on efficient removal of the heat that is generated. A three dimensional finite element model is constructed using base plate having pins, DBC copper with a solder layer having substrate and IGBT chips. AlSiC is used as a base plate material. The thermal performance of the module is characterized by geometric and material variables of substrate, pin sizes and pin density with varying heat transfer coefficient. Commercial Finite Element Analysis software is used for the study of an IGBT module.

Keywords

aluminium compounds; finite element analysis; hybrid electric vehicles; insulated gate bipolar transistors; silicon compounds; thermal analysis; wide band gap semiconductors; AlSiC; DBC copper; IGBT 6-pack power modules; base plate material; commercial finite element analysis software; geometric; heat transfer coefficient; hybrid electric vehicles; material variables; pin density; pin sizes; solder layer; steady state thermal analysis; thermal performance; three dimensional finite element model; Heat transfer; Heating; Insulated gate bipolar transistors; Pins; Substrates; Thermal management; AlSiC base plate; IGBT module; Thermal Management;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892402

Filename

6892402