Title :
The reliability evaluation of Cu wire Bonding by using focus ion beam system
Author :
XiaoWen, Zhang ; XiaoLing, Lin ; Yuan, Chen
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component, Guangzhou, China
Abstract :
The cross sections of bonding have been made by using focus ion beam (FIB) system on the advanced chips packaged with BGA. Through the measurement of aluminum layer thickness under different bond force, the bonding reliability has been evaluated. The comparison has also been made on the interface of Au wire Bonding and Cu wire Bonding. Since the Cu wire Bonding process is more difficult, When it is used in the advanced chips, the bonding reliability should be evaluated.
Keywords :
ball grid arrays; copper; focused ion beam technology; gold; lead bonding; reliability; thickness measurement; Au; Cu; aluminum layer thickness measurement; ball grid arrays; bonding reliability; focus ion beam system; reliability evaluation; wire bonding; Bonding; Copper; Force; Gold; Ion beams; Reliability; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582717
