Mechanical characterization of the IMC layer by using Nano-indentation tests

The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic Compound, which is between lead-free solder Sn3.OAg0.5Cu and Cu-pad, were measured by using nano-indentation tests, while the load-displacement curves, displacement-elastic modulus curve and displacement-hardness curves were recorded. Modulus and hardness of these IMCs were characterized by Nano-indentation CSM from plan view in this study. Basing on these experimental data, The calculation of modulus and hardness for IMC layers was based on nano-indentation CSM test results and was compared with reported results.