Moisture diffusivity analysis of polycarbonate for LED lens

Author

Mao, Zhangming ; Luo, Xiaobing ; Yang, Janghui ; Liu, Sheng

Author_Institution

Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

1080

Lastpage

1087

Abstract

To analyze the effect of moisture on the reliability of LED modules, diffusivity of packaging materials must be provided. Polycarbonate (PC) is an important material for LED lens. Its diffusivity measurement is usually based on the solution of one-dimensional diffusion. In this paper, the diffusivity measurement of PC was conducted. Simulation and analytical close-form solution (CFS) were also used to predict the moisture absorption process. The comparison among the results obtained by analytical solution, simulation and experiments was presented. The results show that they agree well with each other, proving that the present analytical method can be used to calculate the moisture diffusivity coefficient, which is important for LED reliability evaluation.

Keywords

electronics packaging; lenses; light emitting diodes; reliability; LED lens; LED modules reliability; LED reliability evaluation; close-form solution; diffusivity measurement; moisture absorption process; moisture diffusivity analysis; moisture diffusivity coefficient; one-dimensional diffusion; packaging materials; polycarbonate; Absorption; Light emitting diodes; Materials; Moisture; Packaging; Reliability; Uncertainty;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582728

Filename

5582728