Capacitive differential pressure sensor with high overload capability using silicon/glass technology

Author

Hein, S. ; Holzner, K. ; Schlichting, V. ; Obermeier, E. ; Barton, K.

Author_Institution

Robert Bosch GmbH, Reutlingen, Germany

Volume

2

fYear

1997

fDate

16-19 Jun 1997

Firstpage

1477

Abstract

A capacitive pressure sensor for differential pressures of 100 kPa (1 bar) with an overload capability up to 25 MPa (250 bar) without the need for an external overload protection is presented. The sensing element consists of a Pyrex/silicon/Pyrex sandwich and is fabricated in silicon/glass technology using anodic bonding. To increase the overpressure range the sensor element is mounted in a pre-stressed mounting fixture, which was optimized numerically. Results of FEA simulations, technological processing and sensor performance are discussed

Keywords

digital simulation; electric sensing devices; elemental semiconductors; finite element analysis; glass; microsensors; pressure sensors; silicon; simulation; 1 bar; 100 kPa; 25 MPa; 250 bar; FEA simulations; Pyrex/Si/Pyrex sandwich; Si; Si/glass technology; anodic bonding; capacitive differential pressure sensor; differential pressures; external overload protection; fabrication; high overload capability; prestressed mounting fixture; sensing element; sensor performance; technological processing; Capacitance; Capacitive sensors; Glass; Mechanical sensors; Piezoresistance; Protection; Silicon; Temperature dependence; Temperature distribution; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.635744

Filename

635744