Title :
Accurate, cost effective absolute pressure sensor
Author :
Suzuki, Yoshitaka ; Kudo, Takahiro ; Ikeda, Kyoichi
Author_Institution :
Micromachining Lab., Yokogawa Electr. Corp., Nagano, Japan
Abstract :
An accurate, cost effective absolute pressure sensor is presented. The sensor chip has a single crystal silicon diaphragm and a vacuum cavity that is fabricated by micromachining technology using SOI wafers. The vacuum cavity works as a protector against overrange pressure. The measurement range is 170 kPa abs., and the fracture pressure is over 12 MPa, 70 times the measurement range. The sensor chip also has a simple stress isolating structure which reduces the stress caused by gluing it to the package. Though the sensor chip is mounted directly on plastic or a metal base with an adhesive agent, high accuracy and stability are realized. And this structure is highly cost effective
Keywords :
elemental semiconductors; microsensors; packaging; pressure sensors; silicon; silicon-on-insulator; 12 MPa; 170 kPa; SOI wafers; Si; Si diaphragm; Si-Si3N4; Si-SiO2; absolute pressure sensor; accuracy; cost effectiveness; fracture pressure; metal base; micromachining technology; overrange pressure; package; plastic base; sensor chip; stability; stress isolating structure; vacuum cavity; Costs; Isolation technology; Micromachining; Packaging; Pressure measurement; Protection; Semiconductor device measurement; Silicon; Stress; Vacuum technology;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635748
